Hypertherm D845GEBV2 Manuel d'utilisateur Page 76

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Intel Desktop Board D845GEBV2/D845GERG2 Technical Product Specification
76
2.10.3 I/O Shield
The back panel I/O shield for the Desktop Boards D845GEBV2 and D845GERG2 must meet
specific dimension and material requirements. Systems based on these Desktop Boards need the
back panel I/O shield to pass certification testing. Figure 21 shows the I/O shield for Desktop
Boards with the onboard LAN subsystem. Figure 22 shows the I/O shield for Desktop Boards
without the onboard LAN subsystem. Dimensions are given in inches to a tolerance of ±0.02
inches.
The figures also indicate the position of each cutout. Additional design considerations for I/O
shields relative to chassis requirements are described in the ATX specification. See Section 1.5 for
information about the ATX specification.
NOTE
The I/O shield drawings in this document are for reference only. An I/O shield compliant with the
ATX chassis specification 2.03 is available from Intel.
OM11487
0.063 0.005
[1.600 0.120]
8X R0.5 MIN
0.472
[12.000]
0.465
[11.810]
0.027
[0.690]
0.519
[13.190]
3x Dia 0.330 [8.380]
6.390
[162.300]
0.787 0.010 TYP [20 0.254]
3x Dia 0.039 [1.000]
0.884
[22.450]
0.276
[7.012]
0.465
[11.811]
0.567
[14.400]
0.000
[0.000]
0.000
[0.000]
1.807
[45.892]
2.081
[52.854]
3.219
[81.768]
4.840
[122.950]
5.771
[146.577]
A
Pictorial
View
0.447
[11.345]
1.195
[30.360]
REF
Figure 21. I/O Shield Dimensions (for Desktop Boards with the LAN Subsystem)
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