Hypertherm D845GEBV2 Manuel d'utilisateur télécharger pdf (Page 37)

Product Description

1.10 Audio Subsystem

The audio subsystem consists of the following devices:

• Intel 82801DB I/O Controller Hub (ICH4)

• Analog Devices AD1981B audio codec

The audio subsystem includes these features:

• Split digital/analog architecture for improved S/N (signal-to-noise) ratio: ≥ 85 dB

• Power management support for ACPI 2.0 (driver dependant)

• Mono/Stereo mic in pre-amp that supports dynamic, condenser, and electret microphones

The audio subsystem supports the following audio interfaces:

• ATAPI-style connectors:

 Auxiliary line in

 CD-ROM

• Front panel audio connector, including pins for:

 Line out

 Mic in (mono or stereo)

• Back panel audio connectors:

 Line out

 Line in

 Mic in (mono or stereo)

Figure 8 is a block diagram of the audio subsystem.

82801DB

I/O Controller Hub

(ICH4)

OM15116

AC ’97

Link

AD1981B

Audio Codec

Auxiliary Line In

Mic In

Line Out

CD-ROM

Line In

Figure 8. Audio Subsystem Block Diagram

For information about Refer to

Upgrading the onboard audio subsystem using a CNR audio card Section 1.12, page 40

The front panel audio connector Section 2.8.2.2, page 62

The back panel audio connectors Section 2.8.1, page 60

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Hypertherm D845GEBV2 Manuel d'utilisateur Page 37